기술자료

  • Application data
  • Dry & WR & OR
  • 진공용도
  • 계산식
  • 물의증기압
  • 관련사이트
  • 다운로드

  • 고객센터
  • 회사소개
  • 제품소개
 
 
 
서브 메인타이틀
 

Plasma Treatment &
Laser Drilling

 
Process
· Desmear(PCB) & Laser Drilling(PCB)
· Cleaning(Semiconductor)
Purpose
Desmear Laser Drilling Cleaning
Surface Etching Pick & Place Chucking Removing Oxidation Layer
Advantages
· Low Operation & Utility Cost(Oil & etc.)
· Eliminate Oil treatment Problem
· Simple & Stable Vacuum System
· Maximize Product Quality
System Comparison
Before After (Dry type)
Oil Rotary Vacuum pump, Carbon vane pump, Blower Dry Screw Vacuum pump
Application
Description Application Customer
Desmear(PCB) Desmear of Micro holes on Multilayer flexible PCB
Strengthen plating of the inner surface of holes
Jesagi Hankook
Soles
Visonsemicon
Laser Drilling Pick & Place
Chucking
Laviatech
EO Technics
Cleaning(Semicon.) Pretreatment of semiconductor’package Samsung
Hynix
Process Comparison
Before After (Dry type)
Waste oil treatment problem Eliminate oil treatment problem
Too much Utility Cost
(Frequent vacuum oil, vane change & overhaul)
No oil change required One Year Overhaul
Low production efficiency Shorten process cycle
Unstable Vacuum level due to oil contamination Mechanical type operation keeps constant Vacuum level
High Noise level Contact free Dry operation Low Noise level
working environment is dirty
(Frequent vacuum oil change)
working environment is clean